Japan-based ROHM Co Ltd and Taiwan Semiconductor Manufacturing Co (TSMC) have entered a strategic partnership on development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.
At the 70th annual IEEE International Electron Devices Meeting (IEDM 2024) in San Francisco, CA, USA (7–11 December), nanoelectronics research center imec of Leuven
As the next step in their strategic co-operation, STMicroelectronics of Geneva, Switzerland has reached a multi-year agreement from 2026 to supply its silicon carbide (SiC) power modules.